ASX Earnings Date: Feb 4, 2027 (Estimated) — ASE Technology Holding Co., Ltd.
NYSE · Technology · Semiconductors
Updated
When is ASX's next earnings date?
ASE Technology Holding Co., Ltd. (ASX) is expected to report Q4 2026 earnings on Thursday, February 4, 2027 at 1:00 AM ET (before market open); the date is an estimate and has not been confirmed by the company. The consensus estimate is EPS of $0.42 on revenue of $7.64B.
How did ASX do in its last earnings report?
In its most recent report on Oct 29, 2026 (Q3 2026), ASE Technology Holding Co., Ltd. posted EPS of $0.37 versus the $0.34 estimate, a beat of 8.8%. Revenue was $7.53B against a $7.30B estimate. The stock's 1-day post-earnings move was +1.4%.
How much does ASX stock move after earnings?
ASX beat EPS estimates in 3 of its last 6 reported quarters. Over the last 8 reports the stock moved an average of 5.0% (up or down) in the day after earnings.
About ASE Technology Holding Co., Ltd.
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
🤖 AI Earnings Analysis
ASE’s semiconductor packaging and testing results were strong: revenue rose 32% year over year to $7.5B, beating estimates, while EPS more than doubled to $0.37. The simultaneous sales and earnings beats point to broad-based strength.
AI-generated summary — powered by BigEarnings.
Earnings History
| Date | Period | EPS Est. | EPS Act. | Surprise | Revenue | Result | 1D Δ | 1W Δ | 1M Δ |
|---|---|---|---|---|---|---|---|---|---|
| 2026-10-29 | Q3 2026 | 0.34 | 0.37 | +8.82% | $7.53B | ✅ Beat | +1.43% | — | — |
| 2026-07-30 | Q2 2026 | 0.17 | 0.29 | +71.76% | $6.04B | ✅ Beat | +11.73% | +18.19% | +25.00% |
| 2026-04-29 | Q1 2026 | 0.20 | 0.20 | -2.50% | $5.51B | ❌ Miss | +1.71% | +11.19% | +35.00% |
| 2026-02-05 | Q4 2025 | 0.20 | 0.21 | +5.00% | $5.76B | ✅ Beat | +6.68% | +25.04% | +11.25% |
| 2025-10-30 | Q3 2025 | — | 0.16 | — | $5.67B | — | +4.19% | +9.70% | +3.56% |
| 2025-07-31 | Q2 2025 | 0.14 | 0.11 | -22.14% | $4.89B | ❌ Miss | -8.07% | -5.95% | -3.52% |
| 2025-04-30 | Q1 2025 | — | 0.10 | — | $4.52B | — | +0.34% | +3.44% | +9.42% |
| 2025-02-13 | Q4 2024 | 0.15 | 0.13 | -14.00% | $5.02B | ❌ Miss | +5.57% | +9.20% | -5.66% |
Showing last 8 quarters.
Revenue by segment & region
By segment
FY2022 · $670.87B total · annual
| Segment | Share | Revenue | YoY | FY2018 | FY2019 | FY2020 | FY2021 |
|---|---|---|---|---|---|---|---|
| Packaging service | 45.3% | $303.95B | +11.5% | $178.31B | $198.92B | $218.67B | $272.54B |
| Electronic components manufacturing service | 45.0% | $301.97B | +26.1% | $151.89B | $165.79B | $204.69B | $239.49B |
| Testing service | 8.3% | $55.96B | +12.0% | $35.90B | $42.66B | $47.27B | $49.98B |
| Other Products And Services | 1.3% | $9.00B | +12.7% | $4.99B | $5.82B | $6.35B | $7.99B |
By region
FY2025 · $644.49B total · annual
| Segment | Share | Revenue | YoY | FY2019 | FY2020 | FY2021 | FY2022 |
|---|---|---|---|---|---|---|---|
| UNITED STATES | 56.8% | $365.79B | +2.0% | $245.52B | $297.12B | $353.50B | $446.48B |
| TAIWAN, PROVINCE OF CHINA | 18.0% | $115.97B | +29.9% | $51.24B | $64.83B | $94.60B | $83.66B |
| Asia | 15.2% | $97.82B | +17.9% | $75.94B | $74.45B | $62.52B | $75.99B |
| Europe | 10.1% | $64.91B | +2.3% | $38.61B | $39.48B | $57.91B | $63.54B |
Source: company filings via FMP. YoY compares the same fiscal period a year earlier.