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6147.TWO Earnings — Chipbond Technology Corporation

TWO · Technology · Semiconductor Equipment & Materials

Updated

Price —
Market Cap $151.1B
P/E 48.8
52W Range — – —

When is 6147.TWO's next earnings date?

Chipbond Technology Corporation (6147.TWO) has not announced its next earnings date yet. Its most recent earnings report was on Thursday, July 30, 2026.

How did 6147.TWO do in its last earnings report?

In its most recent report on Jul 30, 2026, Chipbond Technology Corporation posted EPS of $1.30 versus the $1.41 estimate, a miss. Revenue was $6.74B against a $6.31B estimate.

How much does 6147.TWO stock move after earnings?

6147.TWO beat EPS estimates in 0 of its last 1 reported quarter.

About Chipbond Technology Corporation

Chipbond Technology Corporation, along with its affiliated entities, specializes in the research, development, manufacturing, and global distribution of various semiconductor components. Their product portfolio includes advanced metal, gold, and tin-lead bumps, as well as flip chips, tape and reel bonding solutions, and packaging substrates. Operating across Taiwan, the United States, and other international markets, the company delivers comprehensive turnkey services. These encompass diverse bumping manufacturing services (such as gold, solder, and copper bumping), redistribution layer (RDL) processing, and specialized wafer surface treatments like backside metal and dielectric layer coating. Furthermore, they provide wafer grinding, dicing, and precise picking and placing services. Their offerings extend to extensive package and testing services, covering both driver and non-driver integrated circuit testing, driver IC packaging, and wafer-level chip scale packaging (WLCSP). Complementing these are services such as final inspection, detailed failure analysis, and the design and production of chip trays. Beyond these core activities, Chipbond Technology Corporation also engages in the investment, development, manufacturing, and sale of electronic components. They are involved in the entire lifecycle of integrated circuit products and semiconductor-specific materials, from development and production to packaging, testing, and providing after-sales support. Additionally, the company supplies semiconductor components, offers packaging and testing services for semiconductors, and provides various electronic, computer, and communication circuit boards. Established in 1997, the company maintains its headquarters in Hsinchu, Taiwan.

🤖 AI Earnings Analysis

6147.TWO trades at a rich 48.8× earnings despite a 12.84% profit margin; without recent news or guidance data, the valuation leaves limited room for execution misses.

AI-generated summary — powered by BigEarnings.

Earnings History

DatePeriodEPS Est.EPS Act.SurpriseRevenueResult1D Δ1W Δ1M Δ
2026-07-301.411.30—$6.74B❌ Miss———

Showing last 1 quarters.

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Financial data from licensed market-data providers; risk factors from SEC EDGAR filings. AI-powered analysis. Data last updated .